- Base Pressure < 5x10-8 Torr
- Substrate Size 4" diameter
- Substrate Heating 350 oC
- Substrate Rotation 3 - 30 rpm
- Deposition Method Sputtering
- Deposition Mode Sideward (all sources)
- Gas Flow 1 MFC for Ar additional MFCs are optional
- Number of Sources 3 Magnetrons
- Target Size 2"
- Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
- Loading From the side door
- Control: Full automation by PC
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