Sputtering system with three magnetron sources

  • Base Pressure < 5x10-8 Torr
  • Substrate Size 4" diameter
  • Substrate Heating 350 oC
  • Substrate Rotation 3 - 30 rpm
  • Deposition Method Sputtering
  • Deposition Mode Sideward (all sources)
  • Gas Flow 1 MFC for Ar additional MFCs are optional
  • Number of Sources 3 Magnetrons
  • Target Size 2"
  • Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
  • Loading From the side door
  • Control: Full automation by PC

 

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For more detailed information, send an e-mail to info@vaksis.com.

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