This system can be used for deposition of maximum four different materials on a single substrate using sputtering technique.

  • Base Pressure < 2x10-7 Torr
  • Substrate Size: 4" diameter
  • Substrate Bias: RF or DC
  • Substrate Heating: 500oC
  • Substrate Cooling: Water-Cooled
  • Substrate Rotation: 1-30 rpm
  • Deposition Method: Saçtırma
  • Deposition Mode: Upward
  • Number of Sources: 4 off 2" magnetrons
  • Gas Flow: 1 MFC for Ar other MFCs are optional
  • Thickness Measurement: In-situ measurement with Quartz X-tal Oscillator
  • Power Generators: 1 Pulsed RF and 1 Pulsed DC
  • Loading: From the top
  • Control: Full automation by PC
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For more detailed information, send an e-mail to info@vaksis.com.