Sputtering system with three magnetron sources

  • Base Pressure < 5x10-8 Torr
  • Substrate Size: 4" diameter
  • Substrate Heating: 350 oC
  • Substrate Rotation: 3 - 30 rpm
  • Deposition Method: Sputtering
  • Deposition Mode: Sideward (all sources)
  • Gas Flow: 1 MFC for Ar additional MFCs are optional
  • Number of Sources: 3 Magnetrons
  • Target Size: 2"
  • Thickness Measurement: In-situ measurement with Quartz X-tal Oscillator
  • Loading: From the side door
  • Control: Full automation by PC
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For more detailed information, send an e-mail to info@vaksis.com.

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