- Base Pressure < 5x10-8 Torr
- Substrate Size: 4" diameter
- Substrate Heating: 350 oC
- Substrate Rotation: 3 - 30 rpm
- Deposition Method: Sputtering
- Deposition Mode: Sideward (all sources)
- Gas Flow: 1 MFC for Ar additional MFCs are optional
- Number of Sources: 3 Magnetrons
- Target Size: 2"
- Thickness Measurement: In-situ measurement with Quartz X-tal Oscillator
- Loading: From the side door
- Control: Full automation by PC
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