ANGORA PVD 4M
This system can be used for deposition of maximum four different materials on a single substrate using sputtering technique.
- Base Pressure < 2x10-7 Torr
- Substrate Size 4" diameter
- Substrate Bias RF or DC
- Substrate Heating 500oC
- Substrate Cooling Water-Cooled
- Substrate Rotation 3-30 rpm
- Deposition Method Sputtering
- Deposition Mode Upward
- Number of Sources 4 off 2" magnetrons
- Gas Flow 1 MFC for Ar other MFCs are optional
- Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
- Power Generators 1 Pulsed RF and 1 Pulsed DC
- Loading From the top
- Control Full automation by PC
DOWNLOAD BROCHURE
For more detailed information, send an e-mail to info@vaksis.com.
