MiDAS PVD MT 2M3T1ICP
Multi Technique Thin Film Deposition System:
This system can be used for deposition of maximum five different materials on a single substrate using magnetron sputtering and thermal evaporation techniques.
- Base Pressure < 5x10-8 Torr
- Leak Rate < 10-8 Torr.l/s
- Substrate Size 4" diameter
- Substrate Heating Max. 800 oC
- Substrate Rotation 3 - 30 rpm
- Thickness Measurement In-situ measurement with Quartz X-tal Oscillator
- Deposition Mode Upward
- Number of Sources 6
- Resistive Thermal Evaporation Sources 3
- Sputtering Magnetron Sources 2
- Remote Plasma Sources 1 ICP LN-Cooled Shrouds
- Power Generators 3
- Loading From the front door
- Control Full automation by PC
For more detailed information, send an e-mail to info@vaksis.com.
